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Intellectual Property Law
: TinytechIPUS Patent 7799425 - Metal composite nanoparticle
This patent from Ebara Corporation teaches a nanostructured bonding material as a substitute for solder in microelectronics. Claim 1 reads:
1. A composite nanoparticle comprising:
a core comprising an inorganic metal compound and a metal component; and
a coating of an organic substance bonded to said core by physical adsorption.
Full post as published by TinytechIP on September 22, 2010 (boomark / email).
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